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Mechanical design of the copper base plate is optimized for Intel® socket LGA 775 and 771. The assembly features a patent pending design characterized by a topographically mapped CPU contact area which results in a 75% and up to 300% improvement in TIM joint thermal resistance compared to the Apogee™ GT/GTX series. Other types of sockets such as AMD® socket F, AM2, and 940 as well as upcoming sockets similar in design to that of socket 775 may also benefit from the enhanced contact area.
An enhanced tool free retention system using thumb-nuts paired with a universal socket 775 motherboard back-plate guarantee high quality, safe and repeatable mounts.
The following tables report the data collected from testing performed with actual retail processors under 100% load using CPU Burn. Published results are the best of a minimum of 5 mounts using the manufacturer supplied retention mechanism. Flow rate and coolant inlet temperature were maintained at a constant and arbitrarily chosen 1.5 gpm and 30 °C respectively. These results are indicative of our test bench settings and of the tested processors only. Results may vary from one processor to another. Competitive data is provided for comparative purposes, and is only representative of the specific waterblock samples tested here. Where different nozzles were available, best results are provided. Where temperatures only are given, these are averaged- out core values reported by the processor Digital Thermal Sensors (DTS).
|
Intel® Core™ 2 Quad Q6600 G0
(@3500 Mhz - 1.38/1.50 V Actual/Bios) |
|
| Apogee™ GTZ |
50.25 °C
|
| Apogee™ GTX |
58.00 °C
|
|
Intel® Core™ 2 Quad Q9450
(@3500 Mhz - 1.27/1.40 V Actual/Bios) |
|
| Apogee™ GTZ |
61.50 °C
|
| EK Supreme |
62.25 °C
|
| D-Tek Fuzion V2 (with 4.5mm nozzle) |
62.75 °C
|
| Apogee™ GTX |
64.25 °C
|
|
Intel® Core™ 2 Duo E6600 B3
(@3000 Mhz - 1.47/1.55 V Actual/Bios) |
|
| Apogee™ GTZ |
55.50°C
|
| D-Tek Fuzion V2 (with 4.5mm nozzle) |
56.50°C
|
| EK Supreme |
57.00°C
|
| Apogee™ GTX |
58.00°C
|
The following table compares C/W data calculated between temperatures reported by the DTS and those measured from a modified processor featuring an additional thermocouple located at the center of the IHS.
|
Intel® Core™ 2 Quad Q6600 G0
(@3500 MHz – 1.38/1.50 V Actual/Bios) |
||
| @1.5gpm |
C/W (DTS)
|
C/W (IHS)
|
| Apogee™ GTZ |
.143
|
.054
|
| EK Supreme |
.152
|
.058
|
| D-Tek Fuzion V2 (4.5mm nozzle) |
.159
|
.066
|
| Apogee™ GTX |
.203
|
.094
|
The Apogee™ GTZ is shipped with an Intel® Core™ 2 (socket 775) compatible hold-down plate and complies with socket 775 keep-out specification, thus guaranteeing compatibility with all socket 775 type motherboards.
Two optional hold-down plates provide compatibility with the following processors:




Fittings & tubing compatibility
The Apogee™ GTZ ships pre-installed with chrome plated high flow 1/4" BSPP x 1/2" barbs and also includes a pair of 3/8" barb fittings.

Exploded view

The base plate features a rich mirror finish.

The 225 µm (0.009") micro pin matrix is at the heart of the Apogee™ GTZ
lowest ever thermal resistance.
The cold plate surface is topographically mapped to provide an optimized TIM joint with socket 775 & 771 processors. As a result, the Apogee™ GTZ requires a specific mounting orientation with respect to the CPU socket in order to optimize performance as illustrated below:


Introduction
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| Weight | 1.00 lbs |
| Price: | $61.95 |
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